Three-dimensional semiconductor memory devices

ABSTRACT

Three-dimensional (3D) nonvolatile memory devices include a substrate having a well region of second conductivity type (e.g., P-type) therein and a common source region of first conductivity type (e.g., N-type) on the well region. A recess extends partially (or completely) through the common source region. A vertical stack of nonvolatile memory cells on the substrate includes a vertical stack of spaced-apart gate electrodes and a vertical active region, which extends on sidewalls of the vertical stack of spaced-apart gate electrodes and on a sidewall of the recess. Gate dielectric layers extend between respective ones of the vertical stack of spaced-apart gate electrodes and the vertical active region. The gate dielectric layers may include a composite of a tunnel insulating layer, a charge storage layer, a relatively high bandgap barrier dielectric layer and a blocking insulating layer having a relatively high dielectric strength.

CROSS REFERENCE TO RELATED APPLICATIONS

This U.S. non-provisional patent application is a continuation of Ser.No. 15/142,533, filed Apr. 29, 2016; which is a continuation of U.S.patent application Ser. No. 14/830,299, filed Aug. 19, 2015, now U.S.Pat. No. 9,356,159; which is a continuation of U.S. patent applicationSer. No. 14/057,380, filed Oct. 18, 2013, now U.S. Pat. No. 9,136,395,which is a divisional of U.S. patent application Ser. No. 13/220,376,filed Aug. 29, 2011, now U.S. Pat. No. 8,569,827, which claims thebenefit of Korean Patent Application 10-2010-0091140, filed Sep. 16,2010, the entire contents of which are hereby incorporated herein byreference.

BACKGROUND

The present disclosure herein relates to a semiconductor device and amethod of fabricating the same and, more particularly, to athree-dimensional (3D) semiconductor memory device and a method offabricating the same.

Due to characteristics such as miniaturization, multifunction and/orlow-fabricating cost, semiconductor devices are getting the spotlight asan important factor in electronic industries. With the advance ofelectronic industries, requirements for the superior performances and/orlow costs of semiconductor devices are increasing. For satisfying suchrequirements, high-integrating of semiconductor devices is growing.Particularly, high-integrating of semiconductor memory devices storinglogical data is growing more.

In a degree of integration of typical Two-Dimensional (2D) semiconductormemory devices, planar areas that unit memory cells occupy may be mainfactors for deciding the degree of integration. Therefore, a degree ofintegration of the typical 2D semiconductor memory devices may belargely affected by the level of a technology for forming fine patterns.However, the technology for forming the fine patterns may be graduallyreaching limitations, and also, the fabricating costs of semiconductormemory devices may increase because high-cost equipment is required. Forsolving such limitations, 3D semiconductor memory devices includingthree dimensionally-arranged memory cells have been proposed.

SUMMARY

Three-dimensional (3D) nonvolatile memory devices according toembodiments of the invention include a substrate having a well region ofsecond conductivity type (e.g., P-type) therein and a common sourceregion of first conductivity type (e.g., N-type) on the well region. Arecess is provided in the substrate. In some embodiments of theinvention, the recess extends partially through the common sourceregion. A vertical stack of nonvolatile memory cells are provided on thesubstrate. This vertical stack of nonvolatile memory cells includes avertical stack of spaced-apart gate electrodes and a vertical activeregion, which extends on sidewalls of the vertical stack of spaced-apartgate electrodes and on a sidewall of the recess. Gate dielectric layersare provided, which extend between respective ones of the vertical stackof spaced-apart gate electrodes and the vertical active region.

In other embodiments of the invention, the recess extends entirelythrough the common source region, which forms a P-N rectifying junctionwith the well region, and a sidewall of the recess defines an interfacebetween the vertical active region and the well region. In addition,each of the gate dielectric layers may include a composite of: (i) atunnel insulating layer in contact with the vertical active region, (ii)a charge storage layer on the tunnel insulating layer, (iii) a barrierdielectric layer on the charge storage layer; and (iv) a blockinginsulating layer extending between the barrier dielectric layer and arespective gate electrode. In some of these embodiments of theinvention, the barrier dielectric layer may be formed of a materialhaving a greater bandgap relative to the blocking insulating layer.According to still further embodiments of the invention, a protectivedielectric layer is provided on a sidewall of the recess. Thisprotective dielectric layer extends between the vertical active regionand the common source region. A bottom of the recess may also define aninterface between the vertical active region and the well region. Thisvertical active region, which may have a cylindrical shape, may includea plurality of concentrically-arranged semiconductor layers of firstconductivity type having equivalent or different dopant concentrationstherein.

According to additional embodiments of the invention, the vertical stackof spaced-apart gate electrodes has an opening extending therethroughthat is aligned to the recess. In addition, the gate dielectric layersmay have a cylindrical shape, and may be concentrically-arrangedrelative to the plurality of concentrically-arranged semiconductorlayers.

According to still further embodiments of the invention, the verticalactive region includes an active region plug filling the recess and acylindrically-shaped active layer on the active region plug. Thecylindrically-shaped active layer includes a plurality ofconcentrically-arranged semiconductor layers of first conductivity typehaving equivalent or different doping concentrations therein. A verticalstack of at least two spaced-apart gate electrodes of respective groundselection transistors may also be provided, which extend opposite theactive region plug. These ground selection transistors includerespective gate dielectric layers that extend on sidewalls of the activeregion plug. The gate dielectric layers of the vertical stack ofnonvolatile memory cells may be formed of different materials relativeto the gate dielectric layers of the stacked ground selectiontransistors.

Methods of forming three-dimensional (3D) nonvolatile memory devicesaccording to embodiments of the invention may include forming a verticalstack of a plurality of sacrificial layers and a plurality of insulatinglayers arranged in an alternating sequence, on a substrate. A selectiveetching step is then performed to etch through the vertical stack todefine a first opening therein and a recess in the substrate. The recessis filled with an electrically conductive active region plug, which iselectrically connected to a well region in the substrate. A sidewall ofthe first opening is then lined with a first vertical active layerbefore the first opening is filled with a dielectric pattern thatextends on the first vertical active layer. Another selective etchingstep is performed to selectively etch through the vertical stack todefine a second opening therein that exposes the substrate. Portions ofthe sacrificial layers extending between each of the plurality ofinsulating layers in the vertical stack are then replaced with gatedielectric layers and gate electrodes of respective memory cells. Thestep of lining a sidewall of the first opening may include lining asidewall of the first opening with a first vertical active layer thatcontacts an upper surface of the active region plug. The step of fillingthe recess with an active region plug may also include filling therecess with an active region plug having an upper surface that iselevated relative to surface of the substrate. In particular, thesubstrate may include a well region of second conductivity type and acommon source region of first conductivity type extending between thewell region and a surface of the substrate, and the recess containingthe active region plug may extend entirely through the common sourceregion.

According to still further embodiments of the invention, the step oflining a sidewall of the first opening with a first vertical activelayer may be preceded by a step of lining the sidewall of the firstopening with a first electrically insulating sub-layer that contacts anupper surface of the active region plug. A step may also be performed toselectively etching through the first vertical active layer and thefirst electrically insulating sub-layer in sequence to expose the uppersurface of the active region plug. In addition, the step of filling thefirst opening with a dielectric pattern may be preceded by lining aninner sidewall of the first vertical active layer with a second verticalactive layer that contacts the upper surface of the active region plug.These first and second vertical active layers may be formed as doped orundoped cylindrically-shaped silicon layers.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings are included to provide a furtherunderstanding of the inventive concept, and are incorporated in andconstitute a part of this specification. The drawings illustrateexemplary embodiments of the inventive concept and, together with thedescription, serve to explain principles of the inventive concept. Inthe drawings:

FIG. 1A is a plan view illustrating a three-dimensional (3D)semiconductor memory device according to an embodiment of the inventiveconcept;

FIG. 1B is a cross-sectional view taken along line I-I′ of FIG. 1A;

FIG. 1C is a magnified view of a portion A of FIG. 1B;

FIG. 2A is a cross-sectional view taken along line I-I′ of FIG. 1A fordescribing a modification example of a 3D semiconductor memory deviceaccording to an embodiment of the inventive concept;

FIG. 2B is a cross-sectional view taken along line I-I′ of FIG. 1A fordescribing other modification example of a 3D semiconductor memorydevice according to an embodiment of the inventive concept;

FIG. 3A is a cross-sectional view taken along line I-I′ of FIG. 1A fordescribing still other modification example of a 3D semiconductor memorydevice according to an embodiment of the inventive concept;

FIG. 3B is a magnified view of a portion B of FIG. 3A;

FIG. 3C is a magnified view of a portion B of FIG. 3A for describingeven other modification example of a 3D semiconductor memory deviceaccording to an embodiment of the inventive concept;

FIG. 3D is a magnified view of a portion B of FIG. 3A for describing yetother modification example of a 3D semiconductor memory device accordingto an embodiment of the inventive concept;

FIG. 4A is a cross-sectional view taken along line I-I′ of FIG. 1A fordescribing further modification example of a 3D semiconductor memorydevice according to an embodiment of the inventive concept;

FIG. 4B is a magnified view of a portion C of FIG. 4A;

FIG. 5A is a plan view illustrating still further modification exampleof a 3D semiconductor memory device according to an embodiment of theinventive concept;

FIG. 5B is a cross-sectional view taken along line II-II′ of FIG. 5A;

FIGS. 6A to 6H are cross-sectional views taken along line I-I′ of FIG.1A for describing a method of fabricating 3D semiconductor memory deviceaccording to an embodiment of the inventive concept;

FIGS. 7A to 7D are cross-sectional views taken along line I-I′ of FIG.1A for describing a modification example of a method of fabricating 3Dsemiconductor memory device according to an embodiment of the inventiveconcept;

FIGS. 8A to 8F are cross-sectional views taken along line I-I′ of FIG.1A for describing other modification example of a method of fabricating3D semiconductor memory device according to an embodiment of theinventive concept;

FIGS. 9A to 9D are cross-sectional views taken along line I-I′ of FIG.1A for describing still other modification example of a method offabricating 3D semiconductor memory device according to an embodiment ofthe inventive concept;

FIGS. 10A to 10C are cross-sectional views taken along line I-I′ of FIG.1A for describing even other modification example of a method offabricating 3D semiconductor memory device according to an embodiment ofthe inventive concept;

FIG. 11 is a cross-sectional view illustrating a 3D semiconductor memorydevice according to another embodiment of the inventive concept;

FIG. 12A is a cross-sectional view illustrating a modification exampleof a 3D semiconductor memory device according to another embodiment ofthe inventive concept;

FIG. 12B is a cross-sectional view illustrating other modificationexample of a 3D semiconductor memory device according to anotherembodiment of the inventive concept;

FIG. 12C is a cross-sectional view illustrating still other modificationexample of a 3D semiconductor memory device according to anotherembodiment of the inventive concept;

FIG. 12D is a cross-sectional view illustrating even other modificationexample of a 3D semiconductor memory device according to anotherembodiment of the inventive concept;

FIG. 12E is a cross-sectional view illustrating yet other modificationexample of a 3D semiconductor memory device according to anotherembodiment of the inventive concept;

FIG. 12F is a cross-sectional view illustrating further modificationexample of a 3D semiconductor memory device according to anotherembodiment of the inventive concept;

FIGS. 13A to 13E are cross-sectional views for describing a method offabricating 3D semiconductor memory device according to anotherembodiment of the inventive concept;

FIG. 14 is a cross-sectional view illustrating a modification example ofa method of fabricating 3D semiconductor memory device according toanother embodiment of the inventive concept;

FIGS. 15A to 15F are cross-sectional views illustrating othermodification example of a method of fabricating 3D semiconductor memorydevice according to another embodiment of the inventive concept;

FIGS. 16A and 16B are cross-sectional views illustrating still othermodification example of a method of fabricating 3D semiconductor memorydevice according to another embodiment of the inventive concept;

FIG. 17 is a block diagram schematically illustrating an example of anelectronic system including a 3D semiconductor memory device accordingto an embodiment of the inventive concept; and

FIG. 18 is a block diagram schematically illustrating an example of amemory card including a 3D semiconductor memory device according to anembodiment of the inventive concept.

DETAILED DESCRIPTION OF THE EMBODIMENTS

The present invention now will be described more fully with reference tothe accompanying drawings, in which preferred embodiments of theinvention are shown. This invention may, however, be embodied in manydifferent forms and should not be construed as being limited to theembodiments set forth herein; rather, these embodiments are provided sothat this disclosure will be thorough and complete, and will fullyconvey the scope of the invention to those skilled in the art. Likereference numerals refer to like elements throughout.

It will be understood that when an element or layer is referred to asbeing “on,” “connected to” or “coupled to” another element or layer (andvariants thereof), it can be directly on, connected or coupled to theother element or layer or intervening elements or layers may be present.In contrast, when an element is referred to as being “directly on,”“directly connected to” or “directly coupled to” another element orlayer (and variants thereof), there are no intervening elements orlayers present. Like reference numerals refer to like elementsthroughout.

It will be understood that, although the terms first, second, third,etc. may be used herein to describe various elements, components,regions, layers and/or sections, these elements, components, regions,layers and/or sections should not be limited by these terms. These termsare only used to distinguish one element, component, region, layer orsection from another region, layer or section. Thus, a first element,component, region, layer or section discussed below could be termed asecond element, component, region, layer or section without departingfrom the teachings of the present invention.

Spatially relative terms, such as “beneath,” “below,” “lower,” “above,”“upper” and the like, may be used herein for ease of description todescribe one element or feature's relationship to another element(s) orfeature(s) as illustrated in the figures. It will be understood that thespatially relative terms are intended to encompass differentorientations of the device in use or operation in addition to theorientation depicted in the figures. For example, if the device in thefigures is turned over, elements described as “below” or “beneath” otherelements or features would then be oriented “above” the other elementsor features. Thus, the term “below” can encompass both an orientation ofabove and below. The device may be otherwise oriented (rotated 90degrees or at other orientations) and the spatially relative descriptorsused herein interpreted accordingly.

The terminology used herein is for the purpose of describing particularembodiments only and is not intended to be limiting of the presentinvention. As used herein, the singular forms “a,” “an” and “the” areintended to include the plural forms as well, unless the context clearlyindicates otherwise. It will be further understood that the terms“comprising”, “including”, having” and variants thereof, when used inthis specification, specify the presence of stated features, steps,operations, elements, and/or components, but do not preclude thepresence or addition of one or more other features, steps, operations,elements, components, and/or groups thereof. In contrast, the term“consisting of” when used in this specification, specifies the statedfeatures, steps, operations, elements, and/or components, and precludesadditional features, steps, operations, elements and/or components.

Embodiments of the present invention are described herein with referenceto cross-section and perspective illustrations that are schematicillustrations of idealized embodiments (and intermediate structures) ofthe present invention. As such, variations from the shapes of theillustrations as a result, for example, of manufacturing techniquesand/or tolerances, are to be expected. Thus, embodiments of the presentinvention should not be construed as limited to the particular shapes ofregions illustrated herein but are to include deviations in shapes thatresult, for example, from manufacturing. For example, a sharp angle maybe somewhat rounded due to manufacturing techniques/tolerances.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which the present invention belongs. Itwill be further understood that terms, such as those defined in commonlyused dictionaries, should be interpreted as having a meaning that isconsistent with their meaning in the context of the relevant art andwill not be interpreted in an idealized or overly formal sense unlessexpressly so defined herein.

FIG. 1A is a plan view illustrating a 3D semiconductor memory deviceaccording to an embodiment of the inventive concept. FIG. 1B is across-sectional view taken along line I-I′ of FIG. 1A. FIG. 1C is amagnified view of a portion A of FIG. 1B. Referring to FIGS. 1A and 1B,a well region 102 doped with a first conductive dopant may be disposedin a semiconductor substrate 100 (hereinafter referred to as asubstrate). The substrate 100 may be a silicon substrate, a germaniumsubstrate or a silicon-germanium substrate, for example a common sourceregion 105 doped with a second conductive dopant may be formed in thewell region 102. An upper surface of the common source region 105 may bedisposed on the substantially same level as that of the upper surface ofthe substrate 100. A lower surface of the common source region 105 maybe disposed on a level higher than that of a lower surface of the wellregion 102. One of the first and second conductive dopants may be ann-type dopant, and the other may be a p-type dopant. For example, thewell region 102 may be doped with a p-type dopant, and the common sourceregion 105 may be doped with an n-type dopant.

A stack-structure, including insulation patterns 110 a and gate patterns155L, 155 a 1, 155 a and 155U that are stacked alternately andrepeatedly, may be disposed on the common source region 105. A pluralityof the stack-structures may be disposed on the common source region 105.As illustrated in FIG. 1A, the stack-structures may be extended side byside in a first direction. The stack-structures may be spaced apart in asecond direction perpendicular to the first direction. The first andsecond directions may be parallel with the upper surface of thesubstrate 100.

A vertical active pattern 130 may pass through the stack-structure. Thevertical active pattern 130 may be extended into a recess region 120that is formed in the common source region 105 under the vertical activepattern 130. Therefore, the vertical active pattern 130 may be connectedto the well region 102 under the vertical active pattern 130. Asillustrated in FIG. 1B, the recess region 120 may vertically passthrough the common source region 105. A bottom surface of the recessregion 120 may be disposed on a level lower than that of the lowersurface of the common source region 105. The vertical active pattern 130may contact the bottom surface of the recess region 120. Accordingly,the vertical active pattern 130 may contact the well region 102. Also,the vertical active pattern 130 may contact a sidewall of the recessregion 120. As a result, the vertical active pattern 130 may directlycontact the common source region 105.

According to an embodiment of the inventive concept, a portion 122 ofthe well region 102 just under the bottom surface of the recess region120 may have a high dopant concentration. In other words, the firstconductive dopant concentration of the portion 122 of the well region102 may be higher than the first conductive dopant concentration ofanother portion of the well region 102.

According to an embodiment of the inventive concept, the vertical activepattern 130 may have a hollow pipe shape or a macaroni shape. Herein,the lower end of the vertical active pattern 130 may be in a closedstate. The inside of the vertical active pattern 130 may be filled witha filling dielectric pattern 132.

A gate dielectric layer 150 may be disposed between a sidewall of thevertical active pattern 130 and each of the gate patterns 155L, 155 a 1,155 a and 155U. According to an embodiment of the inventive concept, asillustrated in FIG. 1B, the gate dielectric layer 150 may be extended tocover an upper surface and a lower surface of each of the gate patterns155L, 155 a 1, 155 a and 155U. That is, the extended portion of the gatedielectric layer 150 may be disposed between each of the gate patterns155L, 155 a 1, 155 a and 155U and the insulation pattern 110 a adjacentto each of the gate patterns 155L, 155 a 1, 155 a and 155U.

The gate dielectric layer 150 will be described below in more detailwith reference to FIG. 1C. Referring to FIG. 1C, according to anembodiment of the inventive concept, the gate dielectric layer 150 mayinclude a tunnel dielectric layer 141, a charge storage layer 142 and ablocking dielectric layer 143. The tunnel dielectric layer 141 may beadjacent to the sidewall of the vertical active pattern 130, and theblocking dielectric layer 143 may be adjacent to each of the gatepatterns 155L, 155 a 1, 155 a and 155U. The charge storage layer 142 maybe disposed between the tunnel dielectric layer 141 and the blockingdielectric layer 143. According to an embodiment of the inventiveconcept, as illustrated in FIG. 1C, the entirety of the gate dielectriclayer 150 (i.e., the tunnel dielectric layer 141, the charge storagelayer 142 and the blocking dielectric layer 143) may be extended tocover the upper and lower surfaces of each of the gate patterns 155L,155 a 1, 155 a and 155U.

The tunnel dielectric layer 141 may include oxide and/or oxynitride. Thetunnel dielectric layer 141 may be single-layered or multi-layered. Thecharge storage layer 142 may include a dielectric material having trapsfor storing electric charges, for example, the charge storage layer 142may include nitride and/or metal-oxide. The blocking dielectric layer143 may include a high-k dielectric layer having a dielectric constanthigher than that of the tunnel dielectric layer 141. For example, thehigh-k dielectric layer in the blocking dielectric layer 143 may includemetal-oxide such as aluminum-oxide or hafnium-oxide. Furthermore, theblocking dielectric layer 143 may further include a barrier dielectriclayer. The barrier dielectric layer in the blocking dielectric layer 143may include a dielectric material having a greater band gap than thehigh-k dielectric layer in the blocking dielectric layer 143. Forexample, the barrier dielectric layer may include oxide. The barrierdielectric layer may be disposed between the high-k dielectric layer andthe charge storage layer 142.

A lowermost gate pattern 155L in the stack-structure may correspond to aground selection gate. A ground selection transistor including thelowermost gate pattern 155L may include a vertical channel region thatis defined in the sidewall of the vertical active pattern 130. Asillustrated in FIGS. 1A and 1B, the entire lower surface of thelowermost gate pattern 155L may substantially overlap with the commonsource region 105.

An uppermost gate pattern 155U in the stack-structure may correspond toa string selection gate. Gate patterns 155 a 1 and 155 a between theuppermost gate pattern 155U and the lowermost gate pattern 155L maycorrespond to cell gates. A string selection transistor including theuppermost gate pattern 155U and cell transistors including the cellgates may also include vertical channel regions that are defined in thesidewall of the vertical active pattern 130 a. The vertical channelregions of the ground selection transistor, the cell transistor and thestring selection transistor configuring one cell string may be definedin the vertical active pattern 130.

According to an embodiment of the inventive concept, among gate patternsused as the cell gates in the stack-structure, a gate pattern mostadjacent to the lowermost gate pattern 155L may correspond to a dummycell gate. For example, the gate pattern 1551 a disposed just on thelowermost gate pattern 155L may be a dummy gate pattern. For example,the gate pattern 155 a 1 that is stacked secondly from the substrate 100may be a dummy cell gate. Naturally, one of the insulation pattern 110 ais disposed between the lowermost gate pattern 155L and thesecondly-stacked gate pattern 155 a 1. For example, a dummy celltransistor including the secondly-stacked gate pattern 155 a 1 may havethe same shape as that of a cell transistor storing data, but may notserve as the cell transistor. For example, the dummy cell transistor mayperform only a turn-on/off function. Thus, the secondly-stacked gatepattern 155 a 1 may be a second ground selection gate. In this case, thecell string may include a plurality of stacked ground selectiontransistors.

A plurality of the vertical active patterns 130 may pass through each ofthe stack-structures. As illustrated in FIG. 1A, the vertical activepatterns 130 passing though each of the stack-structures may be arrangedin the first direction to form one column. Alternatively, the verticalactive patterns 130 passing though each of the stack-structures may bearranged in a zigzag shape in the first direction.

The vertical active pattern 130 may include a semiconductor material.For example, the vertical active pattern 130 may include the samesemiconductor material as that of the substrate 100. The vertical activepattern 130 may have an undoped state, or may be doped with the firstconductive dopant. The vertical active pattern 130 may have apoly-crystalline state or a single crystalline state. The gate patterns155L, 155 a 1, 155 a and 155U include a conductive material. Forexample, the gate patterns 155L, 155 a 1, 155 a and 155U may include atleast one of a doped semiconductor (for example, doped silicon andothers), a metal (for example, tungsten, aluminum, copper and others), atransition metal (for example, titanium, tantalum and others) or aconductive metal nitride (for example, a titanium nitride, a tantalumnitride and others). The insulation patterns 110 a may include oxide.

A device isolation pattern 160 a may be disposed between thestack-structures. An upper surface of the device isolation pattern 160 aand an upper surface of the stack-structure may substantially becoplanar. An interlayer dielectric 165 may be disposed on the substrate100. A contact plug 167 may be connected to an upper end of the verticalactive pattern 130 through the interlayer dielectric 165. A drain beingdoped with the second conductive dopant may be formed in the upperportion of the vertical active pattern 130. A lower surface of the drainmay be disposed on a level adjacent to an upper surface of the uppermostgate pattern 155U. A bit line 170 may be disposed on the interlayerdielectric 165, and may be connected to the contact plug 167. The bitline 170 may be extended in the second direction and cross over thestack-structure. The interlayer dielectric 165 may include oxide. Thecontact plug 167 includes a conductive material. For example, thecontact plug 167 may include tungsten. The bit line 170 also includes aconductive material. As an example, the bit line 170 may includetungsten, copper, aluminum or the like.

According to the above-described 3D semiconductor memory device, thevertical active pattern 130 may be disposed in the recess region 120passing though the common source region 105 and be connected to the wellregion 102. Moreover, the common source region 105 may be disposed underthe lowermost gate pattern 155L. Therefore, a distance between thevertical active pattern 130 and the common source region can beminimized, and also the vertical active pattern 130 can be connected tothe well region 102. Consequently, a current flowing through thevertical active pattern 130 can quickly flow to the common source region105. Accordingly, the reduction of an amount of current in a celltransistor can be minimized. Also, the vertical active pattern 130 isconnected to the well region 102, such that the erasing operation ofcell transistors is very easy. As a result, the 3D semiconductor memorydevice can be implemented which has excellent reliability and isoptimized for high integration.

Next, the modification examples of the 3D semiconductor memory deviceaccording to an embodiment of the inventive concept will be describedbelow with reference to the accompanying drawings. In the modificationexamples, a description on the same elements as the above-describedelements will be omitted for avoiding a repetitive description.

FIG. 2A is a cross-sectional view taken along line I-I′ of FIG. 1A fordescribing a modification example of a 3D semiconductor memory deviceaccording to an embodiment of the inventive concept. Referring to FIG.2A and according to the modification example, protection dielectricpatterns 173 a may be disposed between the insulation patterns 110 a andthe vertical active pattern 130 and between the inner sidewall of therecess region 120 and the vertical active pattern 130. The protectiondielectric pattern 173 a may include a dielectric material forprotecting the vertical active pattern 130 in a fabricating process. Forexample, the protection dielectric pattern 173 a may include oxide.According to the modification example, a capping semiconductor pattern175 may be disposed on the vertical active pattern 130. The cappingsemiconductor pattern 175 may also be disposed on the protectiondielectric pattern 173 a that is disposed between an uppermostinsulation pattern 110 a and the vertical active pattern 130. The upperend of the vertical active pattern 130 may be disposed on a level lowerthan an upper surface of the uppermost insulation pattern 110 a. Theupper surface of the capping semiconductor pattern 175 and the uppersurface of the uppermost insulation pattern 110 a may be substantiallycoplanar. The capping semiconductor pattern 175 may include the samesemiconductor material as that of the vertical active pattern 130. Thecapping semiconductor pattern 175 may be doped with the secondconductive dopant. The contact plug 167 may be connected to the cappingsemiconductor pattern 175.

FIG. 2B is a cross-sectional view taken along line I-I′ of FIG. 1A fordescribing other modification example of a 3D semiconductor memorydevice according to an embodiment of the inventive concept. Referring toFIG. 2B and according to the modification example, a bottom surface ofthe recess region 120 may be disposed on a level higher than the lowersurface of the common source region 105. In this case, a region 122 abeing counter-doped with the first conductive dopant may be disposedunder the bottom surface of the recess region 120 a. The counter-dopedregion 122 a may contact the vertical active pattern 130 and the wellregion 102. Therefore, the vertical active pattern 130 may be connectedto the well region 102 through the counter-doped region 122 a.

FIG. 3A is a cross-sectional view taken along line I-I′ of FIG. 1A fordescribing still other modification example of a 3D semiconductor memorydevice according to an embodiment of the inventive concept. FIG. 3B is amagnified view of a portion B of FIG. 3A. Referring to FIG. 3A, a gatedielectric layer 150 a according to the modification example may bedisposed between a vertical active pattern 130 a and each of the gatepatterns 155L, 155 a 1, 155 a and 155U. The gate dielectric layer 150 amay include a first sub-layer 147 and a second sub-layer 149. The firstsub-layer 147 may be substantially extended vertically and be disposedbetween the vertical active pattern 130 a and the insulation pattern 110a. The second sub-layer 149 may be substantially extended horizontallyand cover the lower surface and upper surface of each of the gatepatterns 155L, 155 a 1, 155 a and 155U. The gate dielectric layer 150 amay include the tunnel dielectric layer, the charge storage layer andthe blocking dielectric layer. Herein, the first sub-layer 147 mayinclude at least a portion of the tunnel dielectric layer, and thesecond sub-layer 149 may include at least a portion of the blockingdielectric layer. One of the first and second sub-layers 147 and 149 mayinclude the charge storage layer. In other words, a portion of the gatedielectric layer 150 a including the tunnel dielectric layer, the chargestorage layer and the blocking dielectric layer may be extendedvertically, and another portion of the gate dielectric layer 150 a maybe extended horizontally.

The vertical active pattern 130 a may include first and secondsemiconductor patterns 123 and 124. The first semiconductor pattern 123may be disposed between the second semiconductor pattern 124 and thefirst sub-layer 147. The first semiconductor pattern 123 may contact thefirst sub-layer 147. According to an embodiment of the inventiveconcept, the first semiconductor pattern 123 may have a macaroni shapeor a pipe shape where an upper end and a lower end are opened. The firstsemiconductor pattern 123 may not contact the inner surface of therecess region 120 by the first sub-layer 147. The second semiconductorpattern 124 may contact the first semiconductor pattern 123 and theinner surface of the recess region 120. The second semiconductor pattern124 may have a macaroni shape or a pipe shape where a lower end isclosed. A filling dielectric pattern 132 may fill the inside of thesecond semiconductor pattern 124. The first and second semiconductorpatterns 123 and 124 may have an undoped state or be doped with a dopant(i.e., the first conductive dopant) having the same type as that of thewell region 102.

According to an embodiment of the inventive concept, as illustrated inFIG. 3B, the first sub-layer 147 of the gate dielectric layer 150 a mayinclude a tunnel dielectric layer 141, a charge storage layer 142 and abarrier dielectric layer 144. In this case, the second sub-layer 149 mayinclude a high-k dielectric material (for example, metal-oxide such asaluminum oxide or hafnium oxide) having a dielectric constant higherthan that of the tunnel dielectric layer 141. The barrier dielectriclayer 144 may include a dielectric material having a greater band gapthan that of the high-k dielectric material. For example, the barrierdielectric layer 144 may include oxide. The second sub-layer 149 and thebarrier dielectric layer 144, disposed between the charge storage layer142 and each of the gate patterns 155L, 155 a 1, 155 a and 155U, mayincluded in the blocking dielectric layer. In other words, the firstsub-layer 147 may include the tunnel dielectric layer 141, the chargestorage layer 142 and a portion (i.e., the barrier dielectric layer 144)of the blocking dielectric layer, and the second sub-layer 149 mayinclude another portion (i.e., the high-k dielectric layer) of theblocking dielectric layer. However, an embodiment of the inventiveconcept is not limited thereto. The first and second sub-layers of thegate dielectric layer may be combined differently.

FIG. 3C is a magnified view of a portion B of FIG. 3A for describingeven other modification example of a 3D semiconductor memory deviceaccording to an embodiment of the inventive concept. Referring to FIG.3C, a first sub-layer 147 a of a gate dielectric layer 150 b accordingto the modification example may include a tunnel dielectric layer 141and a charge storage layer 142, and a second sub-layer 149 a of the gatedielectric layer 150 b may include a barrier dielectric layer 144 and ahigh-k dielectric layer 146. The high-k dielectric layer 146 may beformed of the same material as the high-k dielectric material that hasbeen described above with reference to FIG. 3B. According to themodification example, the second sub-layer 149 b may correspond to ablocking dielectric layer. According to the modification example, thefirst sub-layer 147 a may include the tunnel dielectric layer 141 andthe charge storage layer 142, and the second sub-layer 149 a may includethe blocking dielectric layer.

FIG. 3D is a magnified view of a portion B of FIG. 3A for describing yetother modification example of a 3D semiconductor memory device accordingto an embodiment of the inventive concept. Referring to FIG. 3D, a firstsub-layer 147 b of a gate dielectric layer 150 c according to themodification example may include the tunnel dielectric layer, and asecond sub-layer 149 b of the gate dielectric layer 150 c may includethe charge storage layer 142 and the blocking dielectric layer 143.According to the modification example, the tunnel dielectric layer inthe gate dielectric layer 150 c may be extended vertically and bedisposed between the vertical active pattern 130 a and the insulationpattern 110 a, and the charge storage layer 142 and the blockingdielectric layer 143 in the gate dielectric layer 150 c may be extendedhorizontally and cover the upper surface and lower surface of each ofthe gate patterns 155L, 155 a 1, 155 a and 155U.

The first and second sub-layers according to an embodiment of theinventive concept are not limited to the modification examples that havebeen described above with reference to FIGS. 3B, 3C and 3D. The firstand second sub-layers may be combined differently.

FIG. 4A is a cross-sectional view taken along line I-I′ of FIG. 1A fordescribing further modification example of a 3D semiconductor memorydevice according to an embodiment of the inventive concept. FIG. 4B is amagnified view of a portion C of FIG. 4A. Referring to FIGS. 4A and 4B,the entirety of a gate dielectric layer 150 d between the verticalactive pattern 130 a and each of the gate patterns 155L, 155 a 1, 155 aand 155U may be substantially extended vertically. That is, the tunneldielectric layer 141, charge storage layer 142 and blocking dielectriclayer 143 of the gate dielectric layer 150 d may be substantiallyextended vertically. An extended portion of the gate dielectric layer150 d may be disposed between the vertical active pattern 130 a and theinsulation pattern 110 a. The stack-structure of FIGS. 1A and 1B mayhave a line shape that is extended in the first direction. Unlike this,the stack-structure may include gate patterns having a flat plate shape.This will be described below with reference to the accompanyingdrawings.

FIG. 5A is a plan view illustrating still further modification exampleof a 3D semiconductor memory device according to an embodiment of theinventive concept. FIG. 5B is a cross-sectional view taken along lineII-II′ of FIG. 5A. Referring to FIGS. 5A and 5B, a stack-structureaccording to the modification example may include gate patterns 220L,220 a, 220 and 220U and insulation patterns 210 and 210U that arestacked alternately and repeatedly. A lowermost gate pattern 220L in thestack-structure may be a ground selection gate, and an uppermost gatepattern 220U in the stack-structure may be a string selection gate. Thegate pattern 220 a just on the lowermost gate pattern 220L may be usedas a cell gate, a dummy cell gate or a second ground selection gate. Thegate patterns 220 between the gate pattern 220 a just on the lowermostgate pattern 220L and the upper gate pattern 220U may be used as cellgates.

The gate patterns 220L, 220 a and 220 under a string selection gate, asillustrated in FIGS. 5A and 5B, may have a flat plate shape. Theuppermost gate pattern 220U corresponding to the string selection gatemay have a line shape that is extended in the first direction. Theuppermost gate pattern 220U may be provided in plurality, and theuppermost gate patterns 220U may be extended side by side in the firstdirection. The bit line 170 may be extended in the second direction andcross over the uppermost gate pattern 220U. Like the uppermost gatepattern 220U, an uppermost insulation pattern 210U on the uppermost gatepattern 220U may also be extended in the first direction.

The vertical active pattern 130 a may pass through the stack-structureand be extended into the recess region 120 under it. The lowermost gatepattern 220L corresponding to the ground selection gate may be disposedon the common source region 105 in the substrate 100. The entire lowersurface of the lowermost gate pattern 220L may substantially overlapwith the common source region 105. According to the modificationexample, the gate dielectric layer 150 d may be disposed between thevertical active pattern 130 a and the inner sidewall of an opening 115passing through the stack-structure. The gate dielectric layer 150 d maybe substantially extended vertically. The opening 115 and the recessregion 120 may be self-aligned. The gate dielectric layer 150 d may beextended into the recess region 120. According to an embodiment of theinventive concept, the lower end of the gate dielectric layer 150 d inthe recess region 120 may be disposed on a level higher than the lowersurface of the recess region 120.

A lower interlayer dielectric 163 may be disposed between the uppermostgate patterns 220U. An upper surface of the lower interlayer dielectric163 may be coplanar with an upper surface of the uppermost insulationpattern 210U. An upper interlayer dielectric 165 may be disposed on thelower interlayer dielectric 163 and the uppermost gate patterns 220U.The insulation patterns 210 and 210U may include oxide, nitride and/oroxynitride. The gate patterns 220L, 220 a, 220 and 220U may include atleast one of a doped semiconductor (for example, doped silicon), a metal(for example, tungsten and others) or a conductive metal nitride (forexample, a titanium nitride, a tantalum nitride and others).

The elements of the above-described modification examples may becombined or replaced. For example, the capping semiconductor pattern 175of FIG. 2A may be disposed on the vertical active pattern 130 or 130 athat has been disclosed in FIG. 1B, 3A, 4A or 5B.

FIGS. 6A to 6H are cross-sectional views taken along line I-I′ of FIG.1A for describing a method of fabricating 3D semiconductor memory deviceaccording to an embodiment of the inventive concept. Referring to FIG.6A, a well region 102 may be formed by providing a first conductivedopant into the substrate 100. A common source region 105 may be formedby providing a second conductive dopant into the upper portion of thewell region 102. Insulation layers 110 and sacrificial layers 112 may bealternately and repeatedly stacked on the common source region 105. Forexample, the insulation layers 110 may be formed as oxide layers. Thesacrificial layers 112 may be formed of materials having an etchselectivity with respect to the insulation layers 112. For example, thesacrificial layers 112 may be formed as nitride layers.

Referring to FIG. 6B, an opening 115 and a recess region 120 may beformed by sequentially patterning the insulation layers 110, sacrificiallayers 112 and the substrate 100. The opening 115 may pass through theinsulation layers 110 and sacrificial layers 112, and the recess region120 may be formed in the common source region 102 under the opening 115(i.e., in a portion of the substrate 100). The recess region 120 isself-aligned in the opening 115 by sequentially patterning theinsulation layers 110 and sacrificial layers 112 and the substrate 100.The recess region 120 may pass through the common source region 105, andthe bottom surface of the recess region 120 may be disposed on a levellower than the lower surface of the common source region 105. Therefore,the well region 102 may be exposed to the bottom surface of the recessregion 120, and the common source region 105 may be exposed to the innersidewall of the recess region 120. A high concentration region 122 maybe formed by providing the first conductive dopant into the well region102 through the bottom surface of the recess region 120. The highconcentration region 122 of the first conductive dopant may be higherthan another portion of the well region 102. That is, due to the highconcentration region 122, the well region 102 may partially have a highdopant concentration.

Referring to FIG. 6C, a semiconductor layer may be conformally formed onthe substrate 100 having the opening 115 and the recess region 120.Therefore, the semiconductor layer may be formed to have a substantiallyuniform thickness on the inner surface of the recess region 120 and aninner sidewall of the opening 115. The semiconductor layer may contactthe inner surface (i.e., an inner sidewall and a bottom surface) of therecess region 120. The semiconductor layer may be formed in a chemicalvapor deposition process and/or an atomic layer deposition process. Afilling dielectric layer may be formed on the semiconductor layer tofill the opening 115. For example, the filling dielectric layer may beformed as an oxide layer. By planarizing the filling dielectric layerand the semiconductor layer until the uppermost insulation layer 110 isexposed, a vertical active pattern 130 and a filling dielectric pattern132 may be formed in the opening 115 and the recess region 120.

Referring to FIG. 6D, a trench 135 may be formed by sequentiallypatterning the insulation layers 110 and sacrificial layers 112, suchthat insulation patterns 110 a and the sacrificial patterns 112 a beingalternately and repeatedly stacked may be formed at a side of the trench135. The insulation patterns 110 a and sacrificial patterns 112 a mayinclude the opening 115. That is, the vertical active patterns 130 maysequentially pass through the insulation patterns 110 a and thesacrificial patterns 112 a being alternately and repeatedly stacked onthe substrate 100. Sidewalls of the sacrificial patterns 112 a and theinsulation patterns 110 a are exposed to the trench 135.

Referring to FIG. 6E, empty regions 140 may be formed by removing thesacrificial patterns 112 a exposed to the trench 135. Each of the emptyregions 140 corresponds to a region from which the each sacrificialpattern 112 a is removed. The empty regions 140 may expose some portionsof the sidewall of the vertical active pattern 130, respectively.

Referring to FIG. 6F, a gate dielectric layer 150 may be conformallyformed on the substrate 100 having the empty regions 140. Therefore, thegate dielectric layer 150 may be conformally formed on the innersurfaces of the empty regions 140. The gate dielectric layer 150, asdescribed above with reference to FIGS. 1B and 1C, may include thetunnel dielectric layer, the charge storage layer and the blockingdielectric layer.

A gate conductive layer 155 filling the empty regions 140 may be formedon the substrate 100 having the gate dielectric layer 150. The gateconductive layer 155 may also be formed in the trench 135. Herein, thegate conductive layer 155 may partially fill the trench 135. Therefore,a space surrounded by the gate conductive layer 155 may be formed in thetrench 135. A bottom surface of the space may be lower than aninner-upper surface of the lowermost empty region 140.

Referring to FIG. 6G, the gate patterns 155L, 155 a 1, 155 a and 155Urespectively filling the empty regions 140 may be formed by etching thegate conductive layer 155. The gate patterns 155L, 155 a 1, 155 a and155U are separated by the etching process of the gate conductive layer155. According to an embodiment of the inventive concept, the etchingprocess of the gate conductive layer 155 may be an isotropic etchingprocess. The insulation patterns 110 a and the gate patterns 155L, 155 a1, 155 a and 155U, being alternately and repeatedly stacked on thesubstrate 100, may be included in a stack-structure. Subsequently, adevice isolation insulation layer 160 may be formed to fill the trench135.

Referring to FIG. 6H, the device isolation insulation layer 160 and thegate dielectric layer 150 may be planarized until the uppermostinsulation pattern among the insulation patterns 110 a is exposed.Therefore, a device isolation pattern 160 a may be formed in the trench135. Subsequently, by forming the interlayer dielectric 165, contactplug 167 and bit line 170 of the FIG. 1B on the substrate 100, the 3Dsemiconductor memory device that has disclosed in FIGS. 1A, 1B and 1Cmay be implemented. According to the above-described 3D semiconductormemory device, the opening 115 and the recess region 120 can be formedin self-alignment by sequentially patterning the insulation layers 110,the sacrificial layers 112 and the substrate 100 (i.e. the common sourceregion 105). Therefore, the 3D semiconductor memory device can beimplemented which has excellent reliability and is optimized for highintegration. Next, a method of fabricating the 3D semiconductor memorydevice that has been disclosed in FIG. 2A will be described below withreference to the accompanying drawings. The method may include themethods that have been described above with reference to FIGS. 6A and6B.

FIGS. 7A to 7D are cross-sectional views taken along line I-I′ of FIG.1A for describing a modification example of a method of fabricating 3Dsemiconductor memory device according to an embodiment of the inventiveconcept.

Referring to FIGS. 6B and 7A, a protection dielectric layer 173 may beconformally formed on the substrate 100 having the opening 115 and therecess region 120, and the protection dielectric layer 173 may be etchedby a blanket anisotropic etching process until the bottom surface of therecess region 120 is exposed. As illustrated in FIG. 7A, therefore, theprotection dielectric layer 173 may be formed on the sidewalls of therecess region 120 and the opening 115. The protection dielectric layer173 may include a dielectric material having an etch selectivity withrespect to the sacrificial layer 112. For example, the protectiondielectric layer 173 may be formed of oxide.

Subsequently, a semiconductor layer may be formed, a filling dielectriclayer may be formed on the semiconductor layer, and the fillingdielectric layer and the semiconductor layer may be planarized.Therefore, the vertical active pattern 130 and the filling dielectricpattern 132 may be formed in the opening 115 and the recess region 120.The vertical active pattern 130 may contact the bottom surface of therecess region 120. The protection dielectric layer 173 may be disposedbetween the vertical active pattern 130 and the inner sidewalls of theopening 115 and the recess region 120.

Referring to FIG. 7B, the upper ends of the vertical active pattern 130,filling dielectric pattern 132 and protection dielectric layer 175 maybe recessed lower than the upper surface of the uppermost insulationlayer 110. Subsequently, a capping semiconductor layer filling theopening 110 may be formed on the substrate 100, and a cappingsemiconductor pattern 175 may be formed by planarizing the cappingsemiconductor layer until the uppermost insulation layer 110 is exposed.The capping semiconductor pattern 175 may cover the recessed upper endsof the vertical active pattern 130, filling dielectric pattern 132 andprotection dielectric layer 175.

Subsequently, the trench 135 may be formed by sequentially patterningthe insulation layers 110 and the sacrificial layers 112. In this case,as described above, the insulation patterns 110 and the sacrificialpatterns 112 a that are alternately and repeatedly stacked may be formedat a side of the trench 135.

Referring to FIG. 7C, the sacrificial patterns 112 a exposed to thetrench 135 may be removed. Therefore, the empty regions 140 may beformed which respectively exposes some portions of the protectiondielectric layer 173 disposed on the sacrificial patterns 112 a and thevertical active patterns 130. As described above, the protectiondielectric layer 173 has an etch selectivity with respect to thesacrificial patterns 112 a, and thus it can protect the vertical activepattern 130 from a process of removing the sacrificial patterns 112 a.The protection dielectric layer 173 may be used as an etch stop layer inthe process of removing the sacrificial patterns 112 a. Subsequently,the exposed portions of the protection dielectric layer 173 may beremoved. Therefore, the empty regions 140 may expose some portions ofthe side wall of the vertical active pattern 130, respectively. Whenremoving the exposed portions of the protection dielectric layer 173,the protection dielectric patterns 173 a may be formed between thevertical active pattern 130 and the insulation patterns 110 a andbetween the vertical active pattern 130 and the inner sidewall of therecess region 120. The protection dielectric patterns 173 a correspondto remaining portions of protection dielectric layer 173.

Referring to FIG. 7D, the gate dielectric layer 150 may be conformallyformed on the substrate 100 having the empty regions 140, and the gatepatterns 155L, 155 a 1, 155 a and 155U respectively filling the emptyregions 140 may be formed. Afterwards, the device isolation pattern 160a filling the trench 135 may be formed. Subsequently, by forming theinterlayer dielectric 165, contact plug 167 and bit line 170 of FIG. 2A,the 3D semiconductor memory device of FIG. 2A can be implemented.

The features of a method, that fabricates the 3D semiconductor memorydevice that has been disclosed in FIG. 2B, may have a process of formingthe lower surface of the recess region 120 higher than the lower surfaceof the common source region 105 and a process of forming thecounter-doped region 122 a by counter-doping the common source region105 under the bottom surface of the recess region 120 with the firstconductive dopant. Other processes may be the same as the processes thathave been described above with reference to FIGS. 7A to 7D.

Next, a method of fabricating the 3D semiconductor memory device thathas been disclosed in FIG. 3A will be described below with reference tothe accompanying drawings. The method may include the methods that havebeen described above with reference to FIGS. 6A and 6B.

FIGS. 8A to 8F are cross-sectional views taken along line I-I′ of FIG.1A for describing other modification example of a method of fabricating3D semiconductor memory device according to an embodiment of theinventive concept.

Referring to FIGS. 6B and 8A, a first sub-layer 147 may be conformallyformed on the substrate 100 having the opening 115 and the recess region120. The first sub-layer 147 may be conformally formed on the innersidewall of the opening 115 and the inner surface of the recess region120. A first semiconductor layer 121 may be conformally formed on thesubstrate 100 having the first sub-layer 147.

Referring to FIG. 8B, portions of the first sub-layer 147 and the firstsemiconductor layer 121 disposed on the bottom surface of the recessregion 120 may be removed. At this point, portions of the firstsub-layer 147 and the first semiconductor layer 121 disposed outsideopening 115 may also be removed. Therefore, the first sub-layer 147 andthe first semiconductor pattern 123 that are sequentially stacked on thesidewalls of the recess region 120 and opening 115 may be formed. Thefirst semiconductor pattern 123 corresponds to a portion of the firstsemiconductor layer 121. According to an embodiment of the inventiveconcept, by blanket-anisotropic-etching the first semiconductor layer121 and the first sub-layer 147 until the bottom surface of the recessregion 120 is exposed, the first semiconductor pattern 123 may beformed. The first semiconductor pattern 123 may not contact the innersurface of the recess region 120 by the first sub-layer 147.

Referring to FIG. 8C, subsequently, by isotropic-etching the firstsub-layer 147, at least one portion of the inner sidewall of the recessregion 120 may be exposed. At this point, a portion of the firstsemiconductor pattern 123 in the recess region 120 may also be etched.

Referring to FIG. 8D, subsequently, a second semiconductor layer may beconformally formed on the substrate 100, a filling dielectric layerfilling the opening 115 may be formed on the second semiconductor layer.The second semiconductor layer may contact the first semiconductorpattern 123, and also the second semiconductor layer may contact thebottom surface and exposed inner sidewall of the recess region 120. Byplanarizing the second semiconductor layer and the filling dielectriclayer, a second semiconductor pattern 124 and a filling dielectricpattern 132 may be formed in the opening 115 and the recess region 120.The second semiconductor pattern 124 may contact the bottom surface andinner sidewall of the recess region 120 and the first semiconductorpattern 123. The first and second semiconductor patterns 123 and 124 mayconfigure a vertical active pattern 130 a.

Referring to FIG. 8E, subsequently, the trench 135, the insulationpatterns 110 a and the sacrificial patterns 112 may be formed bysequentially patterning the insulation layers 110 and the sacrificiallayers 112. The empty regions 140 may be formed by removing thesacrificial patterns 112. At this point, the empty regions 140 mayexpose some portions of the first sub-layer 147, respectively.

Referring to FIG. 8F, a second sub-layer 149 may be conformally formedon the substrate 100 having the empty regions 140. The second sub-layer149 may be conformally formed on the inner surfaces of the empty regions140. The second sub-layer 149 may contact the first sub-layer 147exposed to the empty regions 140. The first and second sub-layers 147and 149 may be included in the gate dielectric layer 150 a. The firstsub-layer 147 may include at least a portion of the tunnel dielectriclayer, and the second sub-layer 149 may include at least a portion ofthe blocking dielectric layer. Herein, one of the first and secondsub-layers 147 and 149 may include the charge storage layer. Accordingto an embodiment of the inventive concept, the first and secondsub-layers 147 and 149 may be the same as the layers that have beendescribed above with reference to FIG. 3B. Unlike this, the first andsecond sub-layers 147 and 149 may be replaced with the first and secondsub-layers 147 a and 149 a of the FIG. 3C, respectively. Unlike this,the first and second sub-layers 147 and 149 may be replaced with thefirst and second sub-layers 149 b and 149 c of the FIG. 3C,respectively. Subsequently, the gate patterns 155L, 155 a 1, 155 a and155U respectively filling the empty regions 140 may be formed, and thedevice isolation pattern 160 a filling the trench 135 may be formed.Subsequently, the interlayer dielectric 165, the contact plug 167 andthe bit line 170 that have been disclosed in FIG. 3A may be formed.Next, a method of fabricating the 3D semiconductor memory device thathas been disclosed in FIGS. 4A and 4B will be described below withreference to the accompanying drawings. The method may include themethods that have been described above with reference to FIGS. 6A and6B.

FIGS. 9A to 9D are cross-sectional views taken along line I-I′ of FIG.1A for describing still other modification example of a method offabricating 3D semiconductor memory device according to an embodiment ofthe inventive concept. Referring to FIGS. 6B to 9A, a gate dielectriclayer 150 d may be conformally formed on the substrate 100 having theopening 115 and the recess region 120. A first semiconductor layer maybe conformally formed on the gate dielectric layer 150 d. Subsequently,the first semiconductor layer and the gate dielectric layer 150 d may beetched by a blanket-anisotropic-etching process until the bottom of therecess region 120 is exposed, such that a first semiconductor pattern123 may be formed in the opening 115 and the recess region 120. At thispoint, the gate dielectric layer 150 d may also be restrictivelydisposed in the opening 115 and the recess region 120. The firstsemiconductor pattern 123 may not contact the side wall of the opening115 and the inner surface of the recess region 120 by the gatedielectric layer 150 d.

Referring to FIG. 9B, subsequently, a second semiconductor may beconformally formed over the substrate 100, and a filling dielectriclayer may be formed on the second semiconductor layer. By planarizingthe filling dielectric layer and the second semiconductor layer, asecond semiconductor pattern 124 and a filling dielectric pattern 132may be formed in the opening 115 and the recess region 120. The firstand second semiconductor patterns 123 and 124 may configure a verticalactive pattern 130 a. Subsequently, a trench 135, insulation patterns110 a and sacrificial patterns 112 a may be formed by sequentiallypatterning the insulation layers 110 and the sacrificial layers 112.According to the modification example, a portion of the lowermostinsulation layer among the insulation layers 110 may remain under thetrench 135.

Referring to FIG. 9C, empty regions 140 may be formed by removing thesacrificial patterns 112 a. The empty regions 140 may expose the gatedielectric layer 150 d. Particularly, the blocking dielectric layer 143(see FIG. 4B) in the gate dielectric layer 150 d may be exposed.Subsequently, a gate conductive layer 155 filling the empty regions 140may be formed on the substrate 100.

Referring to FIG. 9D, by removing the gate conductive layer outside theempty regions 140, gate patterns 155L, 155 a 1, 155 a and 155U fillingthe empty regions 140 may be formed. Subsequently, the device isolationpattern 160 a filling the trench 135 may be formed, and the interlayerdielectric 165, contact plug 167 and bit line 170 of FIG. 4A may beformed. Thus, the 3D semiconductor memory device of FIGS. 4A and 4B canbe implemented. Next, a method of fabricating the 3D semiconductormemory device of FIGS. 5A and 5B will be described below with referenceto the accompanying drawings.

FIGS. 10A to 10C are cross-sectional views taken along line I-I′ of FIG.1A for describing even other modification example of a method offabricating 3D semiconductor memory device according to an embodiment ofthe inventive concept. Referring to FIG. 10A, insulation layers 210 andgate layers 220 may be alternately and repeatedly stacked on the commonsource region 105 in the substrate 100. The insulation layers 210 andgate layers 220L, 220 a and 220 may have a flat plate shape. Referringto FIG. 10B, an uppermost gate pattern 220U and an uppermost insulationpattern 210U may be formed by patterning an uppermost insulation layerand an uppermost gate layer. The uppermost gate pattern 220U and theuppermost insulation pattern 210U may have a line shape that is extendedin one direction as illustrated in FIG. 5A. A lower interlayerdielectric 163 may be formed on the substrate 100, and the lowerinterlayer dielectric 163 may be planarized. An opening 115 and a recessregion 120 may be formed by sequentially patterning the uppermostinsulation pattern 210U, the uppermost gate pattern 220U, the insulationlayers 210, the gate layers 220L, 220 a and 220 and the common sourceregion 105. The recess region 120 may be formed in self-alignment in theopening 115. By providing a first conductive dopant through the bottomsurface of the recess region 120, a high concentration region 122 may beformed. Subsequently, a gate dielectric layer 150 d may be conformallyformed over the substrate 100, and a first semiconductor layer may beconformally formed on the gate dielectric layer 150 d. Byblanket-isotropic-etching the first semiconductor layer and the gatedielectric layer 150 d until the bottom surface of the recess region 120is exposed, a first semiconductor pattern 123 may be formed in theopening 115 and the recess region 120.

Referring to FIG. 10C, a second semiconductor layer may be conformallyformed over the substrate 100, and a filling dielectric layer may beformed on the second semiconductor. By planarizing the fillingdielectric layer and the second semiconductor layer, a secondsemiconductor pattern 124 and a filling dielectric pattern 132 may beformed in the opening 115 and the recess region 120. The first andsecond semiconductor patterns 123 and 124 may configure a verticalactive pattern 130 a. Subsequently, the upper dielectric layer 165,contact plug 167 and bit line 170 of FIG. 5B may be formed. Thus, the 3Dsemiconductor memory device of FIGS. 5A and 5B can be implemented.According to the above-described method, the uppermost gate pattern 220Umay be formed, and thereafter the vertical active pattern 130 a may beformed. Unlike this, after the opening 115, the recess region 120 andthe vertical active pattern 130 a may be formed, and then the uppermostgate pattern 220U may be formed.

When forming the uppermost gate pattern 220U, a stack-structure having aline shape may be formed by sequentially patterning the gate layers 220,220 a and 220L and insulation layers 110 under the uppermost gatepattern 220U. In this case, the 3D semiconductor memory device of FIGS.4A and 4B can be implemented. In other words, the 3D semiconductormemory device of FIGS. 4A and 4B may be implemented in the method thathas been described above with reference to FIG. 9A to 9D or a modifiedmethod of a portion of the fabricating method of FIGS. 10A to 10C.

FIG. 11 is a cross-sectional view illustrating a 3D semiconductor memorydevice according to another embodiment of the inventive concept.Referring to FIG. 11, a well region 102 doped with a first conductivedopant may be disposed in a substrate 100. A stack-structure may bedisposed on the well region 102. The stack-structure may includeinsulation patterns 110 a and gate patterns 155L, 155 a 1, 155 a and155U that are alternately and repeatedly stacked on the well region 102.A plurality of the stack-structures may be disposed on the well region102. The stack-structures may be spaced apart from each other. Asillustrated in FIG. 1a , the stack-structures may be extended inparallel.

A vertical active pattern 280 may pass through the stack-structure.Also, the vertical active pattern 280 may be extended into a recessregion 120 that is formed in the substrate 100 under the vertical activepattern 280. The vertical active pattern 280 may include a lower activepattern 250 and an upper active pattern 270 that are sequentiallystacked. The lower active pattern 250 may fill the recess region 120.The upper active pattern 270 may contact the inner surface (i.e., innersidewall and bottom surface) of the recess region 120. The lower activepattern 250 is disposed in the recess region 120 and contacts the wellregion 102. The upper surface of the lower active pattern 250 may bedisposed on a level higher than that of the upper surface of thesubstrate 100. According to an embodiment of the inventive concept, asillustrated in FIG. 11, the upper surface of the lower active pattern250 may be higher than the lower surface of the lowermost gate pattern155L and lower than the upper surface of the lowermost gate pattern155L. However, the inventive concept is not limited thereto.

The upper active pattern 270 contacts the upper surface of the loweractive pattern 250. According to an embodiment of the inventive concept,the lower active pattern 250 may have a pillar shape, and the upperactive pattern 270 may have a pipe shape or a macaroni shape. In thiscase, the inside of the upper active pattern 270 may be filled with afilling dielectric pattern 132. The lower and upper active patterns 250and 270 may include a semiconductor material. For example, the lower andupper active patterns 250 and 270 may include the same semiconductormaterial as that of the substrate 100. As an example, when the substrate100 is a silicon substrate, the lower and upper active patterns 250 and270 may include silicon. According to an embodiment of the inventiveconcept, the lower active pattern 250 may have a single crystallinestate. The upper active pattern 270 may have a poly-crystalline state.The lower active pattern 250 may be doped with a dopant having the sametype as that of the well region 102. The upper active pattern 270 may bedoped with a dopant having the same type as that of the well region 102,or may have an undoped state.

A high concentration region 122 may be disposed under the bottom surfaceof the recess region 120. The high concentration region 122 maycorrespond to a portion of the well region 102, and it may have a higherdopant concentration than another portion of the well region 102. A gatedielectric layer 150 may be disposed between a sidewall of the verticalactive pattern 280 and each of the gate patterns 155L, 155 a 1, 155 aand 155U. As described above in first embodiment of the inventiveconcept, the gate dielectric layer 150 may be extended horizontally andcover the upper surface and lower surface of each of the gate patterns155L, 155 a 1, 155 a and 155U.

According to an embodiment of the inventive concept, a common sourceregion 105 a may be disposed in the substrate 100 of the both sides ofthe stack-structure, respectively. The common source region 105 a may belaterally separated from the lower active pattern 250. The common sourceregion 105 a is doped with a second conductive dopant. A deviceisolation pattern 160 a may be disposed between the stack-structures.The common source region 105 a may be disposed under the deviceisolation pattern 160 a. In operating of the 3D semiconductor memorydevice, a horizontal channel may be generated in the well region 102under the lowermost gate pattern 155L. The common source region 105 amay be electrically connected to vertical channels that are formed inthe vertical active pattern 280 by the horizontal channel in the wellregion 102.

A contact plug 167 passing through the interlayer dielectric 165 may beconnected to the upper end of the upper active pattern 270. A draindoped with the second conductive dopant may be disposed in the upperportion of the upper active pattern 270. The lower surface of the drainmay be disposed on a level adjacent to the upper surface of theuppermost gate pattern 155U in the stack-structure.

According to the above-described 3D semiconductor memory device, thelower active pattern 250 included in the vertical active pattern 280fills the recess region 120 to contact the well region 102. Therefore,reliability for the operations of a vertical cell string can beimproved. Particularly, reliability for the erasing operation of celltransistors can be enhanced. Also, the vertical active pattern 280 maybe divided into the lower active pattern 250 and the upper activepattern 270. Accordingly, an independent and additional process may beperformed in the lower active pattern 250. For example, a dopantconcentration may be adjusted in the lower active pattern 250. Thus, itis very easy to control the characteristic of the 3D semiconductormemory device. As a result, the 3D semiconductor memory device can beimplemented which has excellent reliability and is optimized for highintegration.

Next, the modification examples of the 3D semiconductor memory devicewill be described below with reference to the accompanying drawings.

FIG. 12A is a cross-sectional view illustrating a modification exampleof a 3D semiconductor memory device according to another embodiment ofthe inventive concept. Referring to FIG. 12A, a common source region 105may be extended to the substrate 100 under the stack-structures. Forexample, the entire lower surface of the lowermost gate pattern 155L maysubstantially overlap with the common source region 105. In this case,the bottom of the recess region 120 may be disposed on a level lowerthan the lower surface of the common source region 105. The commonsource region 105 may contact a sidewall of the lower active pattern250.

FIG. 12B is a cross-sectional view illustrating other modificationexample of a 3D semiconductor memory device according to anotherembodiment of the inventive concept. Referring to FIG. 12B, a verticalactive pattern 280 a may include a lower active pattern 250 and an upperactive pattern 270 a that are sequentially stacked. A gate dielectriclayer 150 a may be disposed between the upper active pattern 270 a andeach of the gate patterns 155 a 1, 155 a and 155U disposed next to theupper active pattern 270 a. The gate dielectric layer 150 a may includea first and a second sub-layers 147 and 149. As described above in firstembodiment of the inventive concept, the first sub-layer 147 may beextended vertically and be disposed between the upper active pattern 270a and the insulation pattern 110 a. The second sub-layer 149 may beextended horizontally and cover the lower surface and upper surface ofeach of the gate patterns 155 a 1, 155 a and 155U.

When the upper surface of the lower active pattern 250 is disposed on alevel between the levels of the lower and upper surfaces of thelowermost gate pattern 155L, the first sub-layer 147 may not existbetween the lower active pattern 250 and the lowermost gate pattern155L. The upper active pattern 270 a may include a first semiconductorpattern 265 and a second semiconductor pattern 267. The firstsemiconductor pattern 265 may be disposed between the first sub-layer147 and the second semiconductor pattern 267. The first semiconductorpattern 265 may be separated from the upper surface of the lower activepattern 250 by a portion of the first sub-layer 147. The secondsemiconductor pattern 267 contacts the first semiconductor pattern 265.Also, the second semiconductor pattern 267 contacts the upper surface ofthe lower active pattern 250.

The upper surface of the lower active pattern 250 may be divided into acenter portion 252 c contacting the second semiconductor pattern 267 andan edge portion 252 e contacting the first sub-layer 147. Herein, thecenter portion 252 c of the upper surface of the lower active pattern250 may be disposed on a level lower than that of the edge portion 252e. The upper active pattern 270 a including the first and secondsemiconductor patterns 265 and 267 may have a pipe shape or a macaronishape. In this case, the inside of the upper active pattern 270 a may befilled with a filling dielectric pattern 132. The first and secondsemiconductor patterns 265 and 267 may have a poly-crystalline state. Inthe modification example, the first and second sub-layers 147 and 149may be replaced by the first and second sub-layers 147 a and 149 a ofFIG. 3C or the first and second sub-layers 147 b and 149 b of FIG. 3C.Unlike this, as described above in first embodiment of the inventiveconcept, the first and second sub-layers 147 and 149 may be formed byanother combination of a tunnel dielectric layer, a charge storage layerand a blocking dielectric layer.

FIG. 12C is a cross-sectional view illustrating still other modificationexample of a 3D semiconductor memory device according to anotherembodiment of the inventive concept. Referring to FIG. 12C, at leastedge portion of the upper surface of the lower active pattern 250 may bedisposed on a level higher than the upper surface of the lowermost gatepattern 155L. In this case, an oxide layer 255 may be disposed betweenthe sidewall of the lower active pattern 250 and the lowermost gatepattern 155L. The oxide layer 255 may include oxide formed by oxidizingthe sidewall of the lower active pattern 250. Therefore, the width of afirst portion of the lower active pattern 250 next to the oxide layer255 may be less than that of a second portion of the lower activepattern 250 disposed in the recess region 120.

When the gate dielectric layer 150 a includes the first and secondsub-layers 147 and 149, the oxide layer 255 and a portion of the secondsub-layer 149 may be disposed between the sidewall of the lower activepattern 250 and the lowermost gate pattern 155L. In other words, thefirst sub-layer 147 may not exist between the sidewall of the loweractive pattern 250 and the lowermost gate pattern 155L. According to anembodiment of the inventive concept, when the first sub-layer 147includes a charge storage layer, the charge storage layer may not existbetween the sidewall of the lower active pattern 250 and the lowermostgate pattern 155L. Therefore, the reliability of a ground selectiontransistor including the lowermost gate pattern 155L can be improved.Moreover, the lower active pattern 250 may have a single crystallinestate. Accordingly, the reliability of the ground selection transistorcan be more enhanced.

FIG. 12D is a cross-sectional view illustrating even other modificationexample of a 3D semiconductor memory device according to anotherembodiment of the inventive concept. Referring to FIG. 12D, at least theedge portion of the upper surface of a lower active pattern 250 may bedisposed on a level higher than the upper surface of a gate pattern 155a 1 that is stacked secondarily from the substrate 100 and lower thanthe lower surface of a gate pattern that is stacked thirdly from thesubstrate 100. The secondarily-stacked gate pattern 155 a 1 and thethirdly-stacked gate pattern are disposed over the lowermost gatepattern 155L. In this case, an oxide layer 255 may also be disposedbetween the secondarily-stacked gate pattern 155 a 1 and the side wallof the lower active pattern 250.

According to the modification example, a transistor including thesecondarily-stacked gate pattern 155 a 1 may be used as a dummytransistor or a second ground selection transistor. In this case, a cellgate (for example, the thirdly-stacked gate pattern 155 a) adjacent tothe secondarily-stacked gate pattern 155 a 1 may correspond to a dummycell gate. As described above, a dummy cell transistor including thedummy cell gate has the same type as that of a cell transistor storingdata, but it may not serve as a cell transistor. As an example, inoperating of the cell string, the dummy cell transistor may perform onlya turn-on/off function. However, the inventive concept is not limitedthereto. The thirdly-stacked gate pattern may be used as a celltransistor.

FIG. 12E is a cross-sectional view illustrating yet other modificationexample of a 3D semiconductor memory device according to anotherembodiment of the inventive concept. Referring to FIG. 12E, the entiretyof a gate dielectric layer 150 d between the sidewall of the upperactive pattern 270 a and each of the gate patterns 155 a 1, 155 a and155U may be substantially extended vertically and be disposed between anupper active pattern 270 a and an insulation pattern 110 a. In thiscase, only an oxide layer 255 may be disposed between the sidewall ofthe lower active pattern 250 and the lowermost gate pattern 155L.

FIG. 12F is a cross-sectional view illustrating further modificationexample of a 3D semiconductor memory device according to anotherembodiment of the inventive concept. Referring to FIG. 12F, protectiondielectric patterns 173 a may be disposed between the upper activepattern 270 a and the insulation patterns 110 a. In a fabricatingprocess, the protection dielectric pattern 173 a may include adielectric material for protecting the upper active pattern 270.According to an embodiment of the inventive concept, the protectiondielectric pattern 173 a may not exist between the lower active pattern250 and the inner sidewall of the recess region 120.

The elements of the above-described modification examples may becombined without clash or replaced. For example, the common sourceregion 105 a of FIG. 11 may be replaced with the common source region105 of FIGS. 12B to 12F. For example, in the 3D semiconductor memorydevices of FIGS. 11 and 12A to 12F, the heights of the upper surfaces ofthe lower active patterns 250 may be replaced.

FIGS. 13A to 13E are cross-sectional views for describing a method offabricating 3D semiconductor memory device according to anotherembodiment of the inventive concept. Referring to FIG. 13A, a wellregion 102 may be formed by providing a first conductive dopant to thesubstrate 100. Insulation layers 110 and sacrificial layers 112 that arealternately and repeatedly stacked may be formed on the well region 102.A recess region 120 and an opening 115 that are sequentially stacked maybe formed by sequentially patterning the insulation layers 110, thesacrificial layers 112 and the substrate 100. The opening 115 may passthrough the insulation layers 110 and the sacrificial layers 112, andthe recess region 120 may be self-aligned in the opening 115 and beformed in the substrate 100. The recess region 120 may expose the wellregion 102.

Referring to FIG. 13B, a high concentration region 122 may be formed byproviding the first conductive dopant through the bottom of the recessregion 120.

A lower active pattern 250 filling the recess region 120 may be formed.The upper surface of the lower active pattern 250 may be higher than theupper surface of the substrate 100. Therefore, a portion of the loweractive pattern 250 may fill the lower portion of the opening 115. Thelower active pattern 250 contacts the well region 102. The lower activepattern 250 may be formed in a selective epitaxial growth process thatuses the substrate 100 exposed by the recess region 120 as a seed layer.Therefore, the lower active pattern 250 may be formed in a singlecrystalline state. The lower active pattern 250 may be formed in apillar shape. The lower active pattern 250 may be doped with the firstconductive dopant. The lower active pattern 250 may be doped by anin-situ process when the selective epitaxial growth process isperformed. Unlike this, the lower active layer 250 may be doped by anion-implanting process.

Referring to FIG. 13C, a semiconductor layer may be conformally formedon the substrate 100 having the lower active pattern 250, and a fillingdielectric layer filling the opening 115 may be formed on thesemiconductor layer. The semiconductor layer may be conformally formedon the inner sidewall of the opening 115 and the upper surface of thelower active pattern 250. The semiconductor layer may contact the loweractive pattern 250. The semiconductor layer may be formed in a chemicalvapor deposition process and/or an atomic layer deposition process.Therefore, the semiconductor layer may be formed in a poly-crystallinestate.

By planarizing the filling dielectric layer and the semiconductor layer,an upper active pattern 270 and a filling dielectric pattern 132 may beformed in the opening 115. The lower and upper active patterns 250 and270 may configure a vertical active pattern 280. Subsequently, a trench135, insulation patterns 110 a and sacrificial patterns 110 a may beformed by sequentially patterning the insulation layers 110 and thesacrificial layers 112. The vertical active pattern 280 passes throughthe insulation patterns 110 a and the sacrificial patterns 112 a.Subsequently, by providing a second conductive dopant into the wellregion 102 under the trench 135, a common source region 105 a may beformed.

Referring to FIG. 13D, by removing sacrificial patterns 112 a exposed tothe trench 135, empty regions 140 may be formed. According to anembodiment of the inventive concept, at least a portion of a lowermostempty regions 140 may expose a portion of the sidewall of the loweractive pattern 250. A gate dielectric layer 150 may be conformallyformed on the substrate 100 having the empty regions 140, and a gateconductive layer 155 filling the empty regions 140 may be formed.

Referring to FIG. 13E, gate patterns 155L, 155 a 1, 155 a and 155U, thatare respectively disposed in the empty regions 140, may be formed byetching the gate conductive layer 155. Subsequently, a device isolationpattern 160 a filling the trench 135 may be formed. The 3D semiconductormemory device of FIG. 11 may be implemented by forming the interlayerdielectric 165, contact plug 167 and bit line 170 of FIG. 11.

According to the above-described 3D semiconductor memory device, theopening 115 and the recess region 120 are formed in self-alignment, andthe lower active pattern 250 fills the recess region 120 to contact thewell region 102. After, the lower active pattern 250 is formed, and thenthe upper active pattern 270 may be formed. Therefore, the dopingconcentration of the lower active pattern 250 may be independentlyadjusted. As a result, the 3D semiconductor memory device havingsuperior reliability can be implemented. The features of the method offabricating 3D semiconductor memory device that is illustrated in FIG.12A will be described below with reference to FIG. 14.

FIG. 14 is a cross-sectional view illustrating a modification example ofa method of fabricating 3D semiconductor memory device according toanother embodiment of the inventive concept. Referring to FIG. 14, asecond conductive dopant is injected into a substrate 100 having a wellregion 102, such that a common source region 105 may be formed.Insulation layers 110 and sacrificial layers 112 that are alternatelyand repeatedly stacked may be formed on the common source region 105. Anopening 115 and a recess region 120 may be formed by sequentiallypatterning the insulation layers 110, the sacrificial layers 112 and thesubstrate 100. The recess region 120 may pass through the common sourceregion 105, and thus the bottom surface of the recess region 120 may belower than the lower surface of the common source region 105. The bottomsurface of the recess region 120 may expose the well region 102, and theinner sidewall of the recess region 120 may expose the common sourceregion 105. Successive processes may be performed identically to theprocess that has been described above with reference to FIG. 13A throughFIG. 13E. However, the process of forming the common source region 105 athat has been described above with reference to FIG. 13C may be omitted.

FIGS. 15A to 15F are cross-sectional views illustrating othermodification example of a method of fabricating 3D semiconductor memorydevice according to another embodiment of the inventive concept. Afabricating method according to the modification example may include themethod that has been described above with reference to FIG. 14.Referring to FIGS. 14 and 15A, a lower active pattern 250 filling therecess region 120 may be formed on the substrate 100 having the opening115 and the recess region 120. The lower active pattern 250 may beformed identically to the process that has been described above withreference to FIG. 13B. The level of the upper surface of the loweractive pattern 250 may be adjusted. In FIG. 15A, the upper surface ofthe lower active pattern 250 may be higher than the level of the uppersurface of a lowermost sacrificial layer and lower than the level of thelower surface of a sacrificial layer just on the lowermost sacrificiallayer. A first sub-layer 147 may be conformally formed on the substrate100 having the lower active pattern 250. A first semiconductor layer 264may be conformally formed on the first sub-layer 147. The firstsemiconductor layer 264 may be formed in a chemical vapor depositionprocess and/or an atomic layer deposition process. The firstsemiconductor layer 264 may be formed in a poly-crystalline state.

Referring to FIG. 15B, the first semiconductor layer 264 and the firstsub-layer 147 may be blanket-anisotropic-etched until the upper surfaceof the lower active pattern 250 is exposed. Therefore, a firstsemiconductor pattern 265 may be formed in the opening 115. According toan embodiment of the inventive concept, the center portion of theexposed upper surface of the lower active pattern 250 may be recessedlower than the edge portion of the upper surface of the lower activepattern 250.

Referring to FIG. 15C, a second semiconductor layer may be conformallyformed on the substrate 100 having the first semiconductor pattern 265,and a filling dielectric layer may be formed on the second semiconductorlayer. The second semiconductor layer may contact the firstsemiconductor pattern 265 and the center portion of the upper surface ofthe lower active pattern 250. By planarizing the filling dielectriclayer and the second semiconductor layer, a second semiconductor pattern267 and a filling dielectric pattern 132 may be formed in the opening115. The first and second semiconductor patterns 265 and 267 mayconfigure an upper active pattern 270 a, and the lower and upper activepatterns 250 and 270 a may configure a vertical active pattern 280 a.Subsequently, a trench 135, insulation patterns 110 a and sacrificialpatterns 112 a may be formed by sequentially patterning the insulationlayers 110 and the sacrificial layers 112.

Referring to FIG. 15D, empty regions 140 may be formed by removing thesacrificial patterns 112 a. According to an embodiment of the inventiveconcept, the lowermost empty region of the empty regions 140 may exposethe sidewall of the lower active pattern 250, and empty regions on thelowermost empty region may expose the first sub-layer 147. However, theinventive concept is not limited thereto. The number of empty regionsfor exposing the sidewall of the lower active pattern 250 may vary withthe height of the edge portion of the upper surface of the lower activepattern 250.

Referring to FIG. 15E, an oxide layer 255 may be formed by performing anoxidizing process in the exposed sidewall of the lower active pattern250. When the lower active pattern 250 is formed of silicon, the oxidelayer 255 may be formed of a silicon oxide. The sidewall of the upperactive pattern 270 a may not be oxidized by the first sub-layer 147.

Referring to FIG. 15F, subsequently, a second sub-layer 149 may beconformally formed over the substrate 100, and gate patterns 155L, 155 a1, 155 a and 155U respectively filling the empty regions 140 may beformed. Subsequently, an isolation pattern 160 a, an interlayerdielectric layer 165, a contact plug 167 and a bit line 170 may beformed. Therefore, the 3D semiconductor memory device of FIG. 12C can beimplemented. In the fabricating method of FIGS. 15A to 15F, the level ofthe upper surface of the lower active pattern 250 may be higher than thelevel of the upper surface of a sacrificial layer that is stackedsecondarily from the upper surface of the substrate 100 and lower thanthe level of the lower surface of a thirdly-stacked sacrificial layer.In this case, the 3D semiconductor memory device of FIG. 12D can beimplemented. In the fabricating method of FIGS. 15A to 15F, when thelevel of the upper surface of the lower active pattern 250 is disposedbetween the levels of the upper and lower surfaces of the lowermostsacrificial layer and the oxidizing process is omitted, the 3Dsemiconductor memory device of FIG. 12B can be implemented. In thefabricating method of FIGS. 15A to 15F, when the first sub-layer 147 isreplaced by the gate dielectric layer 150 d and forming of the secondsub-layer 149 is omitted, the 3D semiconductor memory device of FIG. 12Ecan be implemented. Next, a method of fabricating the 3D semiconductormemory device that is illustrated in FIG. 12F will be described belowwith reference to the accompanying drawings. The method may include themethod that has been described above with reference to FIG. 14.

FIGS. 16A and 16B are cross-sectional views illustrating still othermodification example of a method of fabricating 3D semiconductor memorydevice according to another embodiment of the inventive concept.Referring to FIGS. 14 and 16A, after a lower active pattern 250 may beformed, a protection dielectric layer may be conformally formed on thesubstrate 100. The protection dielectric layer may beblanket-anisotropic-etched until the upper surface of the lower activepattern 250 is exposed. Therefore, a protection dielectric layer 173 maybe 3 formed to have a spacer shape in the sidewall of the opening 115.Subsequently, a semiconductor layer may be conformally formed, and afilling dielectric layer may be formed. The filling dielectric layer andthe semiconductor layer may be planarized, such that an upper activepattern 270 and a filling dielectric pattern 132 may be formed in theopening 115.

Subsequently, the upper ends of the protection dielectric layer 173,upper active pattern 270 and filling dielectric pattern 132 may berecessed, and then a capping semiconductor pattern 175 may be formed.The capping semiconductor pattern 175 may be formed in the same processas the process that has been described above with reference to FIG. 7B.Referring to FIG. 16B, a trench 135, insulation patterns 110 a andsacrificial patterns 112 a may be formed by sequentially patterninginsulation layers 110 and sacrificial layers 112. Empty regions 140 maybe formed by removing the sacrificial patterns 112 a. At this point, theprotection dielectric layer 173 may be used an etch stop layer.Subsequently, by removing some portions of the protection dielectriclayer 173 exposed to the empty regions 140, some portions of thesidewall of the upper active pattern 270 may be exposed. Subsequently,the 3D semiconductor memory device of FIG. 12F can be implemented byperforming the method that has been described above with reference toFIGS. 13D and 13E. According to an embodiment of the inventive concept,after forming the empty regions 140 of FIG. 16B and before forming agate dielectric layer, an oxidizing process may be performed in theexposed sidewall of the lower active pattern 250.

The 3D semiconductor memory devices according to embodiments of theinventive concept may be implemented as various types of packages. Forexample, the 3D semiconductor memory devices according to embodiments ofthe inventive concept may be packaged in a package type such as Packageon Package (PoP), Ball Grid Arrays (BGAs), Chip Scale Packages (CSPs),Plastic Leaded Chip Carrier (PLCC), Plastic Dual In-Line Package (PDIP),Die In Waffle Pack (DIWP), Die In Wafer Form (DIWF), Chip On Board(COB), Ceramic Dual In-Line Package (CERDIP), Plastic Metric Quad FlatPack (MQFP), Thin Quad Flat Pack (TQFP), Small Outline Package (SOP),Shrink Small Outline Package (SSOP), Thin Small Outline Package (TSOP),Thin Quad Flat Pack (TQFP), System In Package (SIP), Multi Chip Package(MCP), Wafer Level Stack Package (WLSP), Die In Wafer Form (DIWF), DieOn Waffle Package (DOWP), Wafer-level Fabricated Package (WFP) andWafer-Level Processed Stack Package (WSP).

A package on which the 3D semiconductor memory device according toembodiments of the inventive concept is mounted may further include atleast one semiconductor device (for example, a controller, a memorydevice and/or a hybrid device) performing another function.

FIG. 17 is a block diagram schematically illustrating an example of anelectronic system including a 3D semiconductor memory device accordingto an embodiment of the inventive concept. Referring to FIG. 17, anelectronic system 1100 according to an embodiment of the inventiveconcept may include a controller 1110, an input/output (I/O) unit 1120,a memory device 1130, an interface 1140, and a bus 1150. The controller1110, the input/output (I/O) unit 1120, the memory device 1130 and/orthe interface 1140 may be connected through the bus 1150. The bus 1150corresponds to a path for transferring data.

The controller 1110 may include at least one of a microprocessor, adigital signal processor, a microcontroller, and logical devices forperforming a function similar to the functions of the elements. Theinput/output unit 1120 may include a keypad, a keyboard, a displaydevice and others. The memory device 1130 may store data and/orcommands. The memory device 1130 may include at least one of the 3Dsemiconductor memory devices according to embodiments of the inventiveconcept. Also, the memory device 1130 may further include another typeof semiconductor memory device (for example, Phase-change Random AccessMemory (PRAM), Magnetoresistive Random Access Memory (MRAM), DynamicRandom Access Memory (DRAM) and/or Static Random Access Memory (SRAM)).The interface 1140 may transmit data to a communication network orreceive data from the communication network. The interface 1140 may havea wired type or a wireless type. For example, the interface 1140 mayinclude an antenna or a wired/wireless transceiver. Although not shown,the electronic system 1100 is a working memory device for improving thefunction of the controller 1110, and may further include a high-speedDRAM and/or a high-speed SRAM.

The electronic system 1100 may be applied to Personal Digital Assistants(PDAs), portable computers, web tablets, wireless phones, mobile phones,digital music players, memory cards, and all electronic devices fortransmitting/receiving information at a wireless environment.

FIG. 18 is a block diagram schematically illustrating an example of amemory card including a 3D semiconductor memory device according to anembodiment of the inventive concept. Referring to FIG. 18, a memory card1200 according to an embodiment of the inventive concept may include amemory device 1210. The memory device 1210 may include at least one ofthe 3D semiconductor memory devices according to embodiments of theinventive concept. Also, the memory device 1210 may further includeanother type of semiconductor memory device (for example, PRAM, MRAM,DRAM and/or SRAM). The memory card 1200 may include a memory controller1220 for controlling data exchange between a host and the memory device1210.

The memory controller 1220 may include a processing unit 1222 forcontrolling the overall operation of the memory card 1200. Also, thememory controller 1220 may include an SRAM 1221 that is used as theworking memory of the processing unit 1222. Furthermore, the memorycontroller 1220 may further include a host interface 1223 and a memoryinterface 1225. The host interface 1223 may include a data exchangeprotocol between the memory card 1200 and the host. The memory interface1225 may connect the memory controller 1220 and the memory device 1210.In addition, the memory controller 1220 may further include an errorcorrection block (ECC) 1224. The error correction block 1224 may detectand correct the error of data that is read from the memory device 1210.Although not shown, the memory card 1200 may further include a ROM thatstores code data for interfacing with the host. The memory card 1200 maybe used as a portable data memory card. On the contrary, the memory card1200 may be implemented as a Solid State Disk (SSD) that may replace thehard disk of a computer system.

According to the above-described 3D semiconductor memory device, thevertical active pattern can be disposed in the recess region of thecommon source region and be connected to the well region. Therefore, thedistance between the vertical active pattern and the common sourceregion can be minimized, and also, the vertical active pattern can beconnected to the well region. As a result, the 3D semiconductor memorydevice which has excellent reliability and is optimized for highintegration can be implemented.

The above-disclosed subject matter is to be considered illustrative andnot restrictive, and the appended claims are intended to cover all suchmodifications, enhancements, and other embodiments, which fall withinthe true spirit and scope of the inventive concept. Thus, to the maximumextent allowed by law, the scope of the inventive concept is to bedetermined by the broadest permissible interpretation of the followingclaims and their equivalents, and shall not be restricted or limited bythe foregoing detailed description.

What is claimed is:
 1. A nonvolatile memory device, comprising: a substrate having a first region of first conductivity type therein and a second region of second conductivity type on the first region; a recess region in the substrate, the recess region extending into the second region; and a plurality of stack-structures of nonvolatile memory cells spaced apart on the substrate, each of the stack-structures comprising: a plurality of gate patterns vertically spaced apart from one another on the substrate; a vertical active pattern extending through each of the stack-structures across from the gate patterns and extending into the recess region; and a gate dielectric layer extending between the gate patterns and the vertical active pattern; wherein the second region is a common source region and extends between at least two vertical active patterns included in directly adjacent ones of the plurality of stack-structures.
 2. The memory device of claim 1, wherein the recess region extends through the second region, and wherein a bottom surface of the recess region is lower than a bottom surface of the second region.
 3. The memory device of claim 1, wherein the plurality of stack-structures are spaced apart from one another extend in a first direction which is parallel with an upper surface of the substrate, and wherein the second region extends in the first direction.
 4. The memory device of claim 1, wherein respective vertical active patterns included in the plurality of stack-structures are spaced apart from each other in a first direction and in a second direction perpendicular to the first direction, and wherein the second region extends in the first and second directions.
 5. The memory device of claim 1, wherein the gate patterns overlap with the second region when viewed from a plan view.
 6. The memory device of claim 1, wherein the gate dielectric layer comprises a tunnel dielectric layer adjacent to the vertical active pattern, a blocking dielectric layer adjacent to the gate pattern, and a charge storage layer between the tunnel dielectric layer and the blocking dielectric layer.
 7. The memory device of claim 1, wherein the gate dielectric layer horizontally extends and covers a lower surface and an upper surface of a respective gate pattern.
 8. The memory device of claim 1, further comprising: a protective dielectric layer provided on a sidewall of the recess region, wherein the protective dielectric layer extends between the vertical active pattern and the common source region.
 9. The memory device of claim 1, wherein the vertical active pattern comprises a lower active pattern filling the recess region and an upper active pattern having a cylindrical shape on the lower active pattern.
 10. The memory device of claim 9, wherein the lower active pattern contacts the first region and the second region.
 11. The memory device claim 9, wherein the lower active pattern has a non-planar upper surface that is higher than an upper surface of the substrate. 